Electronic device having heat collection/diffusion structure

ABSTRACT

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

TECHNICAL FIELD

Various embodiments of the present disclosure relate to an electronicdevice having a heat collection/diffusion structure.

BACKGROUND ART

Electronic devices such as a smart phone or a tablet computer arebecoming important means for delivering rapidly changing information.Such electronic devices facilitate a user's work through a GraphicalUser Interface (GUI) environment using a touch screen, and providesvarious multimedia media based on a web environment.

In order to provide various functions, electronic devices are equippedwith various communication components and electronic components. Forexample, an electronic device is equipped with a stereo speaker moduleso as to provide a music listening function using stereo sound. Inaddition, an electronic device is equipped with a camera module so as toprovide a photographing function. Further, an electronic device isequipped with a communication module so as to provide a communicationfunction with other electronic devices through a network.

Moreover, for higher performance electronics, more electronic componentsare mounted on a printed circuit board in a confined space.

DETAILED DESCRIPTION OF THE INVENTION Technical Problem

Since the main body of an electronic device is slimmed and ahigh-specification Application Processor (AP) or the like is used, heatgenerated from components equipped in the electronic device mayincrease.

As a heat generation source of an electronic device, a printed circuitboard (hereinafter referred to as a “board”) on which various electroniccomponents are mounted may be a main heat generation source, relativelyhigh heat is generated from an AP mounted on the board, and heatdissipation from such heat generation components is one of importanthardware design considerations.

Various embodiments of the present disclosure may provide an electronicdevice having a heat collection/diffusion structure of a heat generationcomponent using a heat pipe, among a plurality of components mounted ona board.

Technical Solution

An electronic device according to various embodiments of the presentdisclosure may include: a housing including a first face that faces afirst direction, and a second face that faces a second direction, whichis opposite the first direction; a printed circuit board insertedbetween the first face and the second face; an electronic componentdisposed on the printed circuit board; a shielding structure including aconductive structure at least partially enclosing the electroniccomponent, the shielding structure being mounted on the printed circuitboard; and a heat pipe including a first end and a second end, whereinthe first end is thermally coupled to a portion of the shieldingstructure, and the first end is disposed closer to the shieldingstructure than the second end.

An electronic device according to various embodiments of the presentdisclosure may include: a support structure; a printed circuit boardincluding a first face that faces the support structure and a secondface opposite the first face; at least one heat generation sourcedisposed on the first face of the printed circuit board; a shieldingstructure including a conductive structure at least partially enclosingthe electronic device, and mounted on the printed circuit board; and aheat pipe disposed on the support structure and having a first end and asecond end opposite the first end, wherein the first end is thermallycoupled to the heat generation source, so that heat is transferred fromthe heat generation source.

An electronic device according to various embodiments of the presentdisclosure may include: a support structure; a printed circuit boardincluding a first face that faces the support structure and a secondface opposite the first face; at least one heat generation sourcedisposed on the first face of the printed circuit board; a shieldingstructure including a conductive structure at least partially enclosingthe heat generation source, and mounted on the printed circuit board; aheat pipe disposed on the support structure and having a first end and asecond end opposite the first end, wherein the first end is thermallycoupled to the heat generation source, and the heat pipe transfers heatof the first portion, which is transferred from the heat generationsource, to the second end; and a heat collection device disposed on thesupport structure and thermally coupled to the heat generation source soas to collect heat, generated from the heat generation source, at thefirst portion of the heat pipe.

An electronic device according to various embodiments of the presentdisclosure may include: a housing including a first face that faces afirst direction, and a second face that faces a second direction, whichis opposite the first direction; a printed circuit board insertedbetween the first face and the second face; a plurality of heatgeneration components disposed on the printed circuit board; a shieldingstructure including a conductive structure at least partially enclosingthe electronic device, the shielding structure being mounted on theprinted circuit board; a heat pipe including a first portion and asecond portion, wherein the first portion is thermally coupled to aportion of the shielding structure, and the first portion is disposedcloser to the shielding structure than the second portion; and at leastone heat collection/diffusion member disposed between each of the heatgeneration components and the heat pipe to be thermally coupled theretoso as to collect heat of the heat generation components, or to diffuseheat, transferred via the heat pipe, to a peripheral region.

Advantageous Effects

Various embodiments of the present disclosure may provide an electronicdevice having a heat collection/diffusion structure of a heat generationcomponent using a heat pipe.

Various embodiments of the present disclosure may provide an electronicdevice having a heat collection/diffusion structure of a heat generationcomponent by including a heat transfer structure in a shieldingstructure while maintaining the shielding structure.

Various embodiments of the present disclosure may provide an electronicdevice having a heat collection/diffusion structure capable oftransferring heat to a portion that is relatively cooler than a heatgeneration component using a metal-made heat collection device or a heatpipe.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view illustrating the front face of anelectronic device according to various embodiments;

FIG. 1B is a perspective view illustrating the rear face of theelectronic device according to various embodiments;

FIG. 1C is a diagram showing six sides of the electronic deviceaccording to various embodiments, respectively;

FIGS. 2 and 3 are exploded perspective views each illustrating aconfiguration of an electronic device according to various embodiments;

FIG. 4 is a plan view illustrating a state in which a heat pipeaccording to various embodiments of the present disclosure is disposedin an electronic device;

FIG. 5 is a plan view illustrating a state in which a heat pipeaccording to various embodiments of the present disclosure is disposedin an electronic device;

FIG. 6 is a perspective view illustrating a heat pipe according tovarious embodiments of the present disclosure;

FIG. 7A is an exemplary view illustrating a heat transfer flow of a heatpipe, to which a heat collection device according to various embodimentsof the present disclosure is coupled;

FIG. 7B is a cross-sectional view taken along line A-A in FIG. 7A;

FIG. 7C is a cross-sectional view taken along line B-B in FIG. 7A;

FIG. 8A is a cross-sectional view illustrating a heat transfer structureof a heat pipe, to which a heat collection device according to variousembodiments of the present disclosure is coupled;

FIG. 8B is a view illustrating an electronic device, in which the heatpipe to which the heat collection device according to variousembodiments of the present disclosure is coupled, is disposed;

FIG. 8C is a cross-sectional view illustrating the electronic device, inwhich the heat pipe to which the heat collection device according tovarious embodiments of the present disclosure is coupled, is disposed;

FIGS. 9 to 14 are cross-sectional views each illustrating an electronicdevice in which a heat transfer structure is applied to a shieldingstructure according to various embodiments of the present disclosure ina stacked form;

FIG. 15 is a perspective view illustrating a board to which a heat pipeis applied in a lateral direction of a shielding structure according tovarious embodiments of the present disclosure;

FIG. 16A is a perspective view illustrating a heat collection deviceaccording to various embodiments of the present disclosure;

FIG. 16B is a plan view illustrating a state in which a portion of theheat pipe is coupled to the heat collection device according to variousembodiments of the present disclosure;

FIGS. 17A to 17D are cross-sectional views each illustrating a state inwhich a portion of a heat pipe is coupled to a support structure inaccordance with various embodiments of the present disclosure;

FIGS. 18A and 18B are cross-sectional views each illustrating a state inwhich a portion of a heat pipe is coupled to a heat collection deviceaccording to various embodiments of the present disclosure;

FIG. 19A is a plan view illustrating a state in which a heat pipe iscoupled to a display reinforcement plate according to variousembodiments of the present disclosure;

FIG. 19B is a cross-sectional view taken along line A-A in FIG. 19A;

FIG. 20A is a plan view illustrating a state in which a heat pipe iscoupled to a rear cover according to various embodiments of thedisclosure;

FIG. 20B is a cross-sectional view taken along line B-B in FIG. 20A;

FIG. 21 is a plan view illustrating a state in which a heat pipe iscoupled to a rear case according to various embodiments of thedisclosure;

FIG. 22A is a view illustrating a state in which a heat pipe is disposedin first and second accommodation recesses according to variousembodiments of the disclosure;

FIG. 22B is a cross-sectional view illustrating the state in which theheat pipe is disposed in the first and second accommodation recessesaccording to various embodiments of the disclosure;

FIG. 23A is a view that a plurality of shielding structures according tovarious embodiments of the present disclosure is provided with a heatcollection/diffusion structure using a clip and a heat pipe;

FIG. 23B is a perspective view illustrating a state in which the clip iscoupled between first and second shielding structures according tovarious embodiments of the present disclosure;

FIG. 24 is a cross-sectional view illustrating a state in which each offirst and second faces of a board according to various embodiments ofthe present disclosure is provided with a heat collection/diffusionstructure;

FIG. 25 is a cross-sectional view illustrating the structure of a PBA,which is provided with a heat collection/diffusion structure accordingto various embodiments of the present disclosure;

FIG. 26 is a cross-sectional view illustrating the structure of a PBA,which is provided with a heat collection/diffusion structure accordingto various embodiments of the present disclosure; and

FIGS. 27 to 29 are exemplary views each illustrating a disposed state ofa heat pipe to which a heat collection/diffusion device according tovarious embodiments of the present disclosure is coupled.

MODE FOR CARRYING OUT THE INVENTION

Hereinafter, various embodiments of the present invention will bedescribed with reference to accompanying drawings. However, variousembodiments of the present invention are not limited to specificembodiments, and it should be understood that modification, equivalent,and/or alternative on the various embodiments described herein can bevariously made. With regard to description of drawings, similarcomponents may be marked by similar reference numerals.

In the disclosure disclosed herein, the expressions “have,” “may have,”“include” and “comprise,” or “may include” and “may comprise” usedherein indicate existence of corresponding features (for example,elements such as numeric values, functions, operations, or components)and do not preclude the presence of additional features.

In the disclosure disclosed herein, the expressions “A or B,” “at leastone of A or/and B,” or “one or more of A or/and B,” and the like usedherein may include any and all combinations of one or more of theassociated listed items. For example, the term “A or B,” “at least oneof A and B,” or “at least one of A or B” may refer to all of the case(1) where at least one A is included, the case (2) where at least one Bis included, or the case (3) where both of at least one A and at leastone B are included.

The terms, such as “first,” “second,” and the like used herein, mayrefer to various elements of various embodiments of the presentinvention, but do not limit the elements. For example, such terms do notlimit the order and/or priority of the elements. Furthermore, such termsmay be used to distinguish one element from another element. Forexample, “a first user device” and “a second user device” indicatedifferent user devices regardless of the order or priority. For example,without departing from the scope of the present invention, a firstelement may be referred to as a second element, and similarly, a secondelement may be referred to as a first element.

It will be understood that when an element (for example, a firstelement) is referred to as being “(operatively or communicatively)coupled with/to” or “connected to” another element (for example, asecond element), it can be directly coupled with/to or connected toanother element or coupled with/to or connected to another element viaan intervening element (for example, a third element). In contrast, whenan element (for example, a first element) is referred to as being“directly coupled with/to” or “directly connected to” another element(for example, a second element), it should be understood that there isno intervening element (for example, a third element).

According to the situation, the expression “configured to (or set to)”used herein may be used as, for example, the expression “suitable for,”“having the capacity to,” “designed to,” “adapted to,” “made to,” or“capable of”. The term “configured to (or set to)” must not mean only“specifically designed to” in hardware. Instead, the expression “adevice configured to” may mean that the device is “capable of” operatingtogether with another device or other components. For example, a“processor configured to (or set to) perform A, B, and C” may mean adedicated processor (for example, an embedded processor) for performinga corresponding operation or a generic-purpose processor (for example, acentral processing unit (CPU) or an application processor) which mayperform corresponding operations by executing one or more softwareprograms which are stored in a memory device.

Terms used in the present invention are used to describe specifiedembodiments of the present invention and are not intended to limit thescope of other embodiments. The terms of a singular form may includeplural forms unless otherwise specified. Unless otherwise definedherein, all the terms used herein, which include technical or scientificterms, may have the same meaning that is generally understood by aperson skilled in the art. It will be further understood that terms,which are defined in a dictionary and commonly used, should also beinterpreted as is customary in the relevant related art and not in anidealized or overly formal way, unless expressly so defined herein invarious embodiments of the present invention. In some cases, even ifterms are terms which are defined in the specification, they may not beinterpreted to exclude embodiments of the present invention.

An electronic device according to various embodiments of the presentdisclosure may include at least one of smartphones, tablet personalcomputers (PCs), mobile phones, video telephones, electronic bookreaders, desktop PCs, laptop PCs, netbook computers, workstations,servers, personal digital assistants (PDAs), portable multimedia players(PMPs), Motion Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3(MP3) players, mobile medical devices, cameras, or wearable devices (forexample, smart glasses, head-mounted-devices (HMDs), electronicapparels, electronic bracelets, electronic necklaces, electronicappcessory, electronic tattoos, smart mirrors, or smart watches).

According to certain embodiments, the electronic devices may be smarthome appliances. The smart home appliances may include at least one of,for example, televisions (TVs), digital video disk (DVD) players,audios, refrigerators, air conditioners, cleaners, ovens, microwaveovens, washing machines, air cleaners, set-top boxes, home automationcontrol panels, security control panels, TV boxes (for example, SamsungHomeSync™, Apple TV™, or Google TV™), game consoles (for example, Xbox™and PlayStation™), electronic dictionaries, electronic keys, camcorders,electronic picture frames, and the like.

According to another embodiment, the electronic devices may include atleast one of medical devices (for example, various portable medicalmeasurement devices (for example, a blood glucose monitoring device, aheartbeat measuring device, a blood pressure measuring device, a bodytemperature measuring device, and the like), a magnetic resonanceangiography (MRA), a magnetic resonance imaging (MRI), a computedtomography (CT), scanners, and ultrasonic devices), navigationelectronic devices, global positioning system receivers (GPSs), eventdata recorders (EDRs), flight data recorders (FDRs), vehicleinfotainment devices, electronic equipment for vessels (for example,navigation systems and gyrocompasses), avionics, security devices, headunits for vehicles, industrial or home robots, automatic teller'smachines (ATMs) of financial institutions, points of sales (POSs) ofstores, or internet of things (for example, light bulbs, varioussensors, electric or gas meters, sprinkler devices, fire alarms,thermostats, street lamps, toasters, exercise equipment, hot watertanks, heaters, boilers, and the like).

According to a certain embodiment, the electronic devices may include atleast one of a part of furniture or buildings/structures, electronicboards, electronic signature receiving devices, projectors, or variousmeasuring instruments (for example, water meters, electricity meters,gas meters, or wave meters, and the like). The electronic devicesaccording to various embodiments may be one or more combinations of theabove-mentioned devices. According to a certain embodiment, anelectronic device may be a flexible electronic device. Also, electronicdevices according to various embodiments of the present disclosure arenot limited to the above-mentioned devices, and may include newelectronic devices according to technology development.

Hereinafter, an electronic device according to various embodiments willbe described with reference to the accompanying drawings. Herein, theterm “user” may refer to a person who uses an electronic device or adevice that uses an electronic device (e.g., an artificial intelligenceelectronic device).

FIG. 1A is a perspective view illustrating the front face of anelectronic device according to various embodiments, FIG. 1B is aperspective view illustrating the rear face of the electronic deviceaccording to various embodiments, and FIG. 1C illustrates the electronicdevice according to various embodiments in a state in which theelectronic device is viewed from front, upper, lower, left and rightsides.

Referring to FIGS. 1A to 1C, an electronic device 100 according tovarious embodiments may be provided with a display 101 (which may alsobe referred to as a “touch screen”) on the front face 1001 thereof. Areceiver 102 may be disposed above the display 101 so as to receive avoice of a communication partner. A microphone 103 may be disposed belowthe display 101 so as to transmit a voice of the user of the electronicdevice to the communication partner.

According to various embodiments, components for conducting variousfunctions of the electronic device 100 may be disposed around thereceiver 102 in the electronic device 100. The components may includeone or more sensor modules 104. The sensor modules 104 may include oneor more of, for example, an illuminance sensor (e.g., an opticalsensor), a proximity sensor (e.g., an optical sensor), an infraredsensor, and an ultrasonic sensor. According to one embodiment, thecomponents may include a front camera 105. According to one embodiment,the components may include an indicator 106 configured to inform theuser of the status information of the electronic device 100.

According to various embodiments, the display device 101 may be formedas a large screen to occupy a greater portion of the front face of theelectronic device 100. A main home screen is displayed as the firstscreen on the display 101 when the electronic device 100 is powered on.In addition, when the electronic device 100 has several pages ofdifferent home screens, the main home screen may be the first homescreen among the several pages of home screens. The home screen maydisplay shortcut icons to execute frequently used applications, a mainmenu switching key, time, weather, or the like. The main menu switchingkey may cause the main screen to be displayed on the display 101. Inaddition, in the upper end of the display 101, status bars may be formedso as to indicate the statuses of the electronic device 100, such as abattery-charging status, a received signal strength, and the currenttime. Below the display 101, a home key 110 a, a menu key 110 b, a backkey 110 c, and the like may be disposed.

According to various embodiments, the home key 110 a may cause the mainhome screen to be displayed on the display 101. For example, when thehome key 110 a is touched in the state in which a home screen, otherthan the main home screen, another home screen, or a menu screen isdisplayed on the display 101, the main home screen may be displayed onthe display 101. In addition, when the home key 110 a is touched whileapplications are executed on the display 101, the main home screen maybe displayed on the display screen 101. In addition, the home key 110 amay also be used in order to cause the most recently used application ora task manager to be displayed on the display 101. The home key 110 amay be deleted from the front portion of the electronic device 100. Afingerprint recognition sensor device may be disposed on the top face ofthe home key 110 a. The home key may be configured to perform a firstfunction (e.g., a home screen return function or a wake-up/sleepfunction) by an operation of physically pressing the home key button,and to perform a second function (e.g., a fingerprint recognitionfunction) by an operation of swiping the top face of the home key.

According to various embodiments, the menu key 110 b may provide aconnection menu that may be used on the display 101. For example, theconnection menu may include, for example, a widget addition menu, abackground screen change menu, a retrieve menu, an edition menu, and anenvironment setting menu. According to various embodiments, the back key10 c may cause the screen, which has been executed just prior to thecurrently executed screen, to be displayed, or may cause the mostrecently used application to be terminated.

According to various embodiments, the electronic device 100 may includea metal frame 120 as a metal housing. The metal frame 120 may bearranged along the rim of the electronic device 100, and may be disposedto expand to at least a partial region of the rear face of theelectronic device 100 that extends from the rim. The metal frame 120 maybe at least a portion of the thickness of the electronic device 100along the rim of the electronic device 100, and may be formed in aclosed loop shape.

According to various embodiments, the metal frame 120 may be disposed inonly a partial region of the rim of the electronic device 100. When themetal frame 120 is a portion of the housing of the electronic device100, the remaining portion of the housing may be replaced by anon-metallic member. In such a case, the housing may be formed in amanner in which the non-metallic member is molded on the metal frame 120through insert injection molding. The metal frame 120 includes one ormore split portions 125 and 126, so that a unit metal frame separated bythe split portions 125 and 126 may be utilized as an antenna radiator.An upper frame 123 may be a unit frame defined by a pair of splitportions 125 formed at a predetermined interval. A lower frame 124 maybe a unit frame defined by a pair of split portions 126 formed at apredetermined interval. The split portions 125 and 126 may be formed inunison when the non-metallic member is molded on a metal member throughinsert injection molding.

According to various embodiments, the metal frame 120 may have a closedloop shape along the rim. When viewed from the front side of theelectronic device 100, the metal frame 120 may include a left frame 121,a right frame 122, an upper frame 123, and a lower frame 124.

According to various embodiments, various electronic components may bedisposed on the lower frame 124. A speaker 108 may be disposed at oneside of the microphone 103. At the other side of the microphone 103, aninterface connector 107 may be disposed such that a datatransmission/reception function by an external device and external powermay be applied thereto in order to charge the electronic device 100. Anear jack hole 109 may be disposed at one side of the interface connector107. All of the above-mentioned microphone 103, speaker 108, interfaceconnector 107, and ear jack hole 109 may be disposed within the regionof the unit frame defined by a pair of split portions 126 disposed inthe lower frame 124. Without being limited thereto, however, at leastone of the above-mentioned electronic components may be disposed withina region that includes the one or more split portions 126, or outsidethe unit frame.

According to various embodiments, various electronic components may alsobe disposed on the upper frame 123. A socket device 116 may be disposedon the upper frame 123, so that a card type external device can beinserted into the socket device 116. The socket device 116 mayaccommodate at least one of an intrinsic ID card for the electronicdevice (e.g., a SIM card or a UIM card) and a memory card for storagespace expansion. An infrared sensor module 118 may be disposed at oneside of the socket device 116, and an auxiliary microphone device 117may be disposed at one side of the infrared sensor module 118. All ofthe above-mentioned socket device 116, the infrared sensor module 118,and the microphone device 117 may be disposed within the region of theunit frame defined by the pair of split portions 125 disposed in theupper frame 123. Without being limited thereto, however, at least one ofthe above-mentioned electronic components may be disposed within aregion that includes one or more split portions 125 or outside the splitportions.

According to various embodiments, at least one first side key button 111may be disposed on the left frame 121. A pair of first side key buttons111 may be disposed on the left frame 121 to partially protrude so as toperform a volume up/down function, a scroll function, or the like.

According to various embodiments, at least one second side key button112 may be disposed on the right frame 122. The second side key buttons112 may perform a power ON/OFF function, a wake-up/sleep function of theelectronic device, or the like.

According to one embodiment, a rear camera 113 may be disposed on therear face 1002 of the electronic device 100, and at least one electroniccomponent 114 may be disposed at one side of the rear camera 113. Forexample, the electronic component 114 may include at least one of anilluminance sensor (e.g., an optical sensor), a proximity sensor (e.g.,an optical sensor), an infrared sensor, an ultrasonic sensor, a heartrate sensor, and a flash device.

According to various embodiments, the front face 1001 including thedisplay 101 may include a flat portion 1011, and left and right curvedportions 1012 and 1013, which are formed on the left and right of theflat portion 1011, respectively. The front face 1001 of the electronicdevice 100 may use a single window, thereby including a display region101 and all of the other regions (e.g., a BM region). The left and rightcurved portions 1012 and 1013 may be formed to extend from the flatportion 1011 in the X-axis direction of the electronic device 100. Theleft and right curved portions 1012 and 1013 may be lateral side facesof the electronic device 100. In such a case, the left and right curvedportions 1012 and 1013 and the left and right metal frames 121 and 122of the metal frame 120 may form the lateral side faces of the electronicdevice 100 together. Without being limited thereto, the front face 1001including the display 101 may include only one of the left and rightcurved portions 1012 and 1013. The front face 1001 may be configured toinclude only the left curved portion 1012 along the flat portion 1011,or to include only the right curved portion 1013 along the flat portion1011.

According to various embodiments, the front face 1001 may include awindow 240 (see FIG. 2) including curved portions 1012 and 1013 on theleft and right and a flexible display module applied to at least aportion of the lower side of the window. According to one embodiment, awindow 130 (see FIG. 3) may be formed in such a manner that the top faceand the rear face thereof are both bent (e.g., hereinafter referred toas a “3-D manner”). However, without being limited thereto, the window130 (see FIG. 3) may be formed in such a manner that the left and rightportions of the top face thereof are formed in a curved shape and therear face thereof is formed as a flat face (hereinafter, referred to asa “2.5D manner”). The window may be formed of a transparent glassmaterial (e.g., sapphire glass) or a transparent synthetic resinmaterial.

According to various embodiments, the electronic device 100 mayselectively display information by controlling a display module. Theelectronic device 100 may control the display module to configure ascreen only on the flat portion 1011. The electronic device 100 maycontrol the display module to configure a screen in any one of the leftand right curved portions 1012 and 11013 together with the flat portion1011. The electronic device 100 may control the display module toconfigure a screen in only one of the left and right curved portions1012 and 1013, except for the flat portion 1011.

According to various embodiments, the entire rear face 1002 of theelectronic device 100 may be formed by one rear external surfacemounting member 115. The rear face 1002 may include a flat portion 1151that is formed substantially in the central portion, and mayadditionally include or may not include a left curved portion and aright curved portion at the left and right sides of the flat portion1151.

FIG. 2 is an exploded perspective view illustrating an electronic deviceaccording to various embodiments. The electronic device 200 according tovarious embodiments may be the same as the electronic device 100described above.

Referring to FIG. 2, according to various embodiments, the electronicdevice 200 may include a PCB 260, an inner support structure 220, adisplay module 230, and a front window 240 (which may be referred to asa first plate facing substantially a first direction) which are disposedin the manner of being sequentially stacked on the upper side of thehousing 210.

According to various embodiments, the electronic device 200 may includea wireless power transmission/reception member 280 (which may include aflexible printed circuit board provided with an antenna pattern), and arear window 250 (which may be referred to as a second plate facingsubstantially a second direction which is opposite the first direction)which may be disposed in the manner of being sequentially stacked on thelower side of the housing 210.

According to one embodiment, a battery pack 270 may be accommodated in abattery pack accommodation space 211 formed in the housing 210, avoidingthe PCB 260. According to one embodiment, the battery pack 270 and thePCB 260 may be disposed in parallel to each other without overlappingwith each other.

According to various embodiments, the display module 230 may be fixed tothe inner support structure 220, and the front window 240 may be fixedto the inner support structure 220 in the manner of being attached by afirst adhesive member 291. According to various embodiments, the rearwindow 250 may be fixed in the manner of being attached to the housing210 by the second adhesive member 292. According to various embodiments,the electronic device may include a side member that surrounds at leasta portion of a space between the first plate and the second plate.

According to various embodiments, the front window 240 may include aflat portion 240 a, and left and right bent portions 240 b and 240 cbent in the opposite directions from the flat portion 240 a. Forexample, the front window 240 may be positioned on the electronic device200 so as to form the front face, and may employ a transparent materialso as to display a screen displayed on the display module 230. Further,the front window 24 may provide an input/output window for varioussensors. According to one embodiment, the left and right bent portions240 b and 240 c are illustrated as being formed in a 3D manner. However,the single-bent shapes may also be applied to the upper and lowerportions in addition to the left and right bent portions, or dual-bentshapes may also be applied to the upper, lower, left, and rightportions. According to one embodiment, a touch panel may be furtherdisposed on the rear face of the front window 240, and may receive atouch input signal from the outside.

According to various embodiments, the display module 230 may be formedin a shape corresponding to that of the front window 240 (a shape havinga corresponding curvature). According to one embodiment, the displaymodule 230 may include left and right bent portions 230 b and 230 cabout the flat portion 230 a. According to one embodiment, a flexibledisplay module may be used for the display module 230. According to oneembodiment, when the rear face of the front window 240 is in the form ofa flat window type (hereinafter, referred to as a “2D form” or “2.5Dform”), the rear face of the front window 240 is flat, and as a result,an ordinary Liquid Crystal Display (LCD) or an On-Cell TSP AMOLED (OCTA)may be applied.

According to various embodiments, the first adhesive member 291 is acomponent for securing the front window 240 to the inner supportstructure (e.g., a bracket) 220 disposed inside the electronic device.The first adhesive member 291 may be a kind of tape, such as adouble-sided tape, or a liquid adhesive layer, such as a glue. Forexample, when a double-sided tape is applied as the first adhesivemember 291, as an inner substrate, a general PET (polyethyleneterephthalate) material may be applied or a functional substrate may beapplied. For example, it is possible to strengthen impact resistance byusing a foam tape or a substrate using an impact resistant fabric inorder to prevent the front window from being damaged by external impact.

According to various embodiments, the inner support structure 220 may bedisposed within the electronic device 200, and may be used as acomponent for reinforcing the overall rigidity of the electronic device.For example, at least one metal of Al, Mg, and STS may be used for theinner support structure 220. According to one embodiment, for the innersupport structure 220, a high-rigidity plastic containing glass fibermay be used, or a metal and a plastic may be used together. According toone embodiment, when a metal material and a non-metal material are usedtogether as the material of the inner support structure 220, the innersupport structure 220 may be formed in the manner of molding thenon-metal material on the metal material through insert injectionmolding. The inner support structure 220 is positioned on the rear faceof the display module 230. The inner support structure 22 may have ashape (curvature) similar to that of the rear face of the display module230, and may support the display module 330. According to oneembodiment, between the inner support structure 220 and the displaymodule 230, a sheet (e.g., an elastic member such as rubber or sponge,or an adhesive layer such as double-sided tape or single-sided tape) maybe additionally disposed so as to protect the display module 230.

According to various embodiments, the electronic device 200 may furtherinclude an auxiliary device for reinforcing the internal rigidity orimproving a thermal characteristic, an antenna characteristic, or thelike by adding a metal or composite material in the form of a sheetmaterial to a hole region 221 as needed.

According to various embodiments, the inner support structure 220 may befastened to the housing (e.g., the rear case) 210 in order to form aspace therein, and one or more electronic components may be disposed insuch a space. The electronic components may include the PCB 260. Withoutbeing limited thereto, however, an antenna device, a sound device, apower supply device, a sensor device, and the like may be included inaddition to the PCB 260.

According to various embodiments, the battery pack 270 may supply powerto the electronic device 200. According to one embodiment, one face ofthe battery pack 270 is adjacent to the display module 230, and theother face is adjacent to the rear window 250. Thus, when the batterypack 270 swells during charging, the counterpart products may bedeformed or damaged. In order to prevent this, it is possible to protectthe battery pack 270 by providing predetermined spaces (swelling gaps)between the battery pack 270 and the counterpart products (e.g., thedisplay module 230 and the rear window 250). According to oneembodiment, the battery pack 270 may be integrally disposed in theelectronic device 200. However, the present disclosure is not limitedthereto, and when the rear window 250 is implemented to be detachablefrom the electronic device 200, the battery pack 270 may be implementedto be detachable.

According to various embodiments, the housing 210 may form the exterior(e.g., the side face including a metallic bezel) of the electronicdevice 200, and may be coupled with the inner support structure 220 soas to form an interior space. According to one embodiment, the frontwindow 240 may be disposed on the front face of the housing 210, and therear window 250 may be disposed on the rear face of the housing 21.However, without being limited thereto, the rear face may be variouslyimplemented using an injection-molded synthetic resin, a metal, acomposite of a metal and a synthetic resin, and the like. According toone embodiment, the gap between the housing 210 and the internalstructure formed by the rear window 250 may prevent the rear window 250from being damaged by secondary impact caused by the internal structurewhen external impact, such as the drop of the electronic device, occurs.

According to various embodiments, the wireless powertransmission/reception member 280 may be disposed on the rear face ofthe housing 210. According to one embodiment, the wireless powertransmission/reception member 280 is attached to one face of an internalmounting component or to a partial region of the inner face of thehousing 210, particularly a region generally adjacent to the rear window250, in the form of a thin film, and includes a structure that forms acontact with the PCB 260 therein. According to one embodiment, thewireless power transmission/reception member 280 may be embedded orattached as a portion of a housing 210 or a component, such as thebattery pack 270, and may be provided in the form of beingsimultaneously attached to both of the component and the housing 210.

According to various embodiments, the second adhesive member 292 is acomponent for fixing the rear window 250 to the housing 210, and may beapplied in a form similar to the above-described first adhesive member291.

According to various embodiments, the rear window 250 may be applied ina form similar to the front window 240 described above. According to oneembodiment, the front face (the face exposed to the outside) of the rearwindow 250 may be formed in a curvature in which an inclined angleincreases toward the left and right ends. According to one embodiment,the rear face of the rear window 250 is formed as a flat face, and maybe bonded to the housing 210 by the second adhesive member 292.

FIG. 3 is an exploded perspective view illustrating a main configurationof the electronic device according to various embodiments.

Referring to FIG. 3, the electronic device 300 according to variousembodiments may have at least one member related to the appearance onthe external face thereof. For example, over a great part of theexternal appearance of the electronic device 300, exterior members, suchas a front cover 310, a rear cover 320, a case 330 including side walls331 located on a lateral side, may be disposed. In addition, in theexternal appearance of the electronic device 300, a home key, areceiver, or the like may be disposed on the front face of theelectronic device 300, a rear camera, a flash, or a speaker may bedisposed on the rear face of the electronic device 300, and a pluralityof physical keys, a connector or a microphone hole may be disposed inthe side walls 331.

In the electronic device 300 according to various embodiments, it may benecessary to configure the members disposed on the exterior of theelectronic device so as to prevent foreign matter, such as water in theexternal environment, from penetrating into the inside of the electronicdevice. The electronic device 300 according to various embodiments mayinclude a front cover 310, a back cover 320, a case 330, a structure340, and a waterproofing structure.

According to various embodiments, the front cover 310 may form the frontface of the electronic device 300, and may form the exterior appearanceof the front face of the electronic device 300. The front cover of theelectronic device 300 according to various embodiments may be made of atransparent member. For example, the transparent member may includetransparent synthetic resin or glass. The display supported on thestructure may include a screen region exposed through the front cover.

According to various embodiments, the rear cover 320 may form the rearface of the electronic device 300, and may form the external appearanceof the rear face of the electronic device 300. According to variousembodiments, the rear cover 320 of the electronic device 300 may beconfigured as a transparent or opaque member. For example, thetransparent member may include a transparent synthetic resin or glass,and the opaque member may be made of a material, such as a translucentor opaque synthetic resin or a metal.

According to various embodiments, the side wall 331 of the case 330 mayform the rim side face of the electronic device 300, and may form theexternal appearance of the side face. According to various embodiments,the side wall 331 of the electronic device may be made of a conductivematerial, i.e. may be configured as a conductive side wall. For example,the side wall may be made of a metal material, so that the side wall mayoperate as an antenna radiator. According to various embodiments, theside wall 331 may surround at least a portion of the space provided bythe front cover 310 and the rear cover 320. According to variousembodiments, the side wall 331 may be formed integrally with aconductive structure or a non-conductive structure.

In the electronic device 300 according to various embodiments, an innerspace defined by the front cover 310, the rear cover 320, and the sidewall 331 may be divided into a first space and a second space by therear case 330. With respect to the rear case 330, the inner space may bedivided into a first space at the rear cover 320 side and a second spaceat the front cover 310 side.

According to various embodiments, there may be provided a plurality ofinner support structures 340, in which a first structure may beconfigured to support the display, a board, and the like and a secondstructure may be configured to support an exterior member. For example,a structure may be configured to be capable of supporting and protectingother components, such as the battery B. According to variousembodiments, the inner support structure 340 may be made of a syntheticresin, a metal, or a combination thereof, and may also be made of ametal alloy containing magnesium.

Hereinafter, a structure for improving the heat dissipation of a heatgeneration component among a plurality of components mounted on a boardof an electronic device will be described.

FIG. 4 is a plan view illustrating a state in which a heat pipeaccording to various embodiments of the present disclosure is disposedin an electronic device.

Referring to FIG. 4, an electronic device 400 according to variousembodiments may employ a heat pipe 450 mounted on an inner supportstructure 420 in order to cool the temperature of a heat generationsource 412. For example, the heat pipe 450 may perform functions oftransferring heat from the heat generation source 412 in a relativelyhot zone to a low temperature region having a relatively lowtemperature, diffusing a heat transfer path to a region around the heatpipe 450, and distributing the heat to a region away from the regionaround the heat pipe 450. The heat pipe 450 may be a heat transfermember capable of transferring a large amount of heat to a relativelylow temperature region using a fluid having a high specific heat.

According to various embodiments, the heat pipe 450 may have one end451, which may be disposed adjacent to the heat generation source 412which is a high temperature region, and the other end 452, which may bedisposed in a low temperature region which is spaced away from the hightemperature region. In the heat pipe 450 according to variousembodiments, the heat generation source 412, which is a high-temperatureregion, may be disposed in a remaining portion of the heat pipe 450,except for the one end 451 and the other end 452.

The heat pipe 450 may be a heat transfer path, a heat transfer diffusionpath, or a heat dispersion path. According to various embodiments, theheat pipe 450 may be configured in various shapes, in which a portion ofthe heat pipe 450 should be disposed close to the heat generation source412 and another portion of the heat pipe 450 should be disposed in a lowtemperature region having a temperature lower than that of the heatgeneration source 412.

According to various embodiments, the heat pipe 450 should not transmitheat to another component 411 disposed in the vicinity thereof whiletransferring heat. To this end, the electronic device 400 according tovarious embodiments may have a heat transfer prevention structure 432configured to prevent heat, generated by the heat pipe 450, from beingtransferred.

According to various embodiments, the electronic device 400 may includea component 411, e.g., a data input device, located near the heatgeneration source 412. The data input device may be a side input device,which may be an external component that may be disposed to be visibleoutside the electronic device 400. For example, the data input devicemay be a first side key button device or a second side key button deviceof the electronic device 400. However, a component disposed near theheat generation source 412 and within a region affected by the heat fromthe heat pipe 450 may also have a heat transfer protection structure.

The heat transfer prevention structure 432, which prevents heat,generated by the heat pipe 450 according to various embodiments, frombeing transferred, may include at least one opening formed in the innersupport structure 420. Hereinafter, the heat transfer preventionstructure 432 may be referred to as an “opening.”

The opening 432 according to various embodiments may extend beyond thelength of the region in which the component 411 is located. For example,heat transferred via the heat generation source 412 may be diffused intothe peripheral region to reach the component 411 while passing throughthe heat pipe 450. However, the heat transfer path may be blocked by theopening 432, so that heat transfer from the component 411 can beblocked. For example, the openings 432 may be configured in a slit orslot shape.

FIG. 5 is a plan view illustrating a state in which a heat pipeaccording to various embodiments of the present disclosure is disposedin an electronic device.

Referring to FIG. 5, an electronic device 500 according to variousembodiments may be the same as each of the electronic devices 100, 200,and 300 illustrated in FIGS. 1A to 1C, FIG. 2, and FIG. 3. Theelectronic device 500 according to various embodiments is different fromthe electronic device 400 illustrated in FIG. 4 in the configuration ofan opening 522, but is the same as the electronic device 400 in theremaining configuration. Thus, descriptions of the remainingconfiguration will be omitted. The opening 522 formed in the innersupport structure 520 of the electronic device according to variousembodiments may include a material 523 having a low heat transfer rate.For example, the material 523 may include an insulating material such asa synthetic resin.

FIG. 6 is a perspective view illustrating a heat pipe according tovarious embodiments of the present disclosure.

Referring to FIG. 6, the heat pipe 650 according to various embodimentsmay be the same as the heat pipe 450 illustrated in FIG. 4. According tovarious embodiments, the heat pipe 650 may include first and secondportions, i.e. a first end 651 and a second end 652. The first portion651 may be one end of the heat pipe 650, and the second portion 652 maybe the other end of the heat pipe 650.

The heat pipe 650 according to various embodiments may be configured invarious shapes. An important point is that the first end 651 may bedisposed close to the heat generation source and the second end 652 maybe disposed in a region that is somewhat spaced apart from the heatgeneration source and has a relatively lower temperature than the heatgeneration source. By disposing such a heat pipe 650 in the electronicdevice, the temperature of the heat generation source can be dispersedto a relatively low temperature region.

The heat pipe 650 according to various embodiments may be formed to havea flat cross-sectional shape in order to maximize an adhesion surfacewith the heat generation source.

The heat pipe 650 according to various embodiments may contain a smallamount of working fluid in a vacuum-treated pipe and may absorb heatfrom a heat generation portion such that the working fluid can bevaporized. The vaporized fluid can be moved by the vapor pressure to acondensation portion and can transfer heat to the outside from thecondensation portion. Then, the fluid can be liquefied. The liquefiedfluid can be returned to the heat generation portion by a capillaryforce due to a micro-structure within the tube, and the heat pipe mayhave a structure in which the working fluid can transfer heat whilerepeating vaporization and liquefaction.

FIG. 7A is an exemplary view illustrating a heat transfer flow of a heatpipe, to which a heat collection device according to various embodimentsof the present disclosure is coupled. FIG. 7B is a cross-sectional viewtaken along line A-A in FIG. 7A. FIG. 7C is a cross-sectional view takenalong line B-B in FIG. 7A.

Referring to FIGS. 7A to 7C, a heat pipe 750 according to variousembodiments of the present disclosure may further include a heatcollection device 760 configured to collect heat generated from the heatgeneration source 712. For example, the heat collection device 760 maybe disposed between the heat generation source and the heat pipe 750,and may transfer the heat of the heat generation source to the heat pipe750. The heat collection device 760 may perform a heat diffusionfunction in addition to the heat collection function. The heatcollection or heat diffusion function may be a part of the heat transferfunction and may be a heat dissipation function that transfers heat in arelatively high temperature region to a low temperature region.

The heat collection device 760 according to various embodiments may havea structure or a shape for transferring the heat generated from the heatgeneration source to the heat pipe 750. The heat generation source(e.g., an AP) may have a chip shape, the top face of which may have arectangular or square shape, and the heat collection device 760 bondedto the top face may also have the rectangular or square shape. The heatcollection device 760 according to various embodiments may have a facesubstantially the same as or slightly smaller than the top face of theheat generation source.

The heat collection device 760 according to various embodiments includesa metal material, and may be made of a material having an excellentthermal conductivity, such as copper. One end 751 of the heat pipe maybe disposed in the heat collection device 760, and the heat collectiondevice 760 and the one end 751 of the heat pipe may be provided with acoupling structure such that the heat collection device and the one endare in contact with each other as wide an area as possible. The heatcollected by the heat collecting device 760 may be transferred to theone end 751 of the heat pipe and then to the other end 752 of the heatpipe end. The arrows may indicate the heat transfer direction. Heattransferred to the heat pipe 750 may be transferred to the supportstructure 720 in a direction away from the heat pipe 750. The heattransferred to the support structure 720 may be transferred to a metalplate 721 such as copper. A shielding sheet 770 may be attached to thetop face of the heat pipe 750.

FIG. 8A is a cross-sectional view illustrating a heat transfer structureof a heat pipe, to which a heat collection device according to variousembodiments of the present disclosure is coupled. FIG. 8B is a viewillustrating an electronic device, in which the heat pipe to which theheat collection device according to various embodiments of the presentdisclosure is coupled, is disposed. FIG. 8C is a cross-sectional viewillustrating the electronic device, in which the heat pipe to which theheat collection device according to various embodiments of the presentdisclosure is coupled, is disposed.

Referring to FIGS. 8A to 8C, an electronic device 800 according tovarious embodiments may be the same as the electronic device 400illustrated in FIG. 4. In addition, the heat pipe 850 according tovarious embodiments may be the same as the heat pipe 650 illustrated inFIG. 6. A heat collection device 860 according to various embodiments ofthe present disclosure may be the same as the heat collection device 760illustrated in FIG. 7.

The electronic device 800 according to various embodiments may include afirst electronic component 812 disposed on a first face of a board 810that faces a first direction, a second electronic component 813 disposedon a second face of the board 810 that faces a second direction oppositethe first direction, and an inner support structure 820 configured tosupport the board 810. The electronic device 800 according to variousembodiments may have a side key button 802 disposed in a third directionperpendicular to the first and second directions. The first electroniccomponent 812 is a heat generation source that generates heat, and maybe disposed to be surrounded by a shielding structure 840.

The electronic device 800 according to various embodiments may include aheat transfer material 830, a heat collection device 860, and a heatpipe 850 in order to dissipate the heat generated from the heatgeneration source 812 to a relatively low temperature region. Inaddition, the heat pipe 850 according to various embodiments may be thesame as the heat pipe 650 illustrated in FIG. 6. The heat collectiondevice 860 according to various embodiments of the present disclosure isa heat transfer device, which may be the same as the heat collectiondevice 760 illustrated in FIG. 7.

The heat generation source 812 according to various embodiments may beof a chip type and may include an Application Processor (AP), a CentralProcessor (CP), a Power Amplifier (PA) of a Radio Frequency (RF) unit,and the like mounted on the board.

The electronic device 800 according to various embodiments may furtherinclude a Thermal Interfacing Material (TIM) 830 for transferring theheat of the heat generation source 812 to the heat collection device860.

The TIM 830 according to various embodiments may include a single layeror a multi-layer. For example, the TIM 830 may have a constant thicknessand may be opaque. According to one embodiment, the TIM 830 may havethermal conductivity. For example, the TIM 830 may have thermalconductivity of 1 W/mk or more (e.g., 4 W/mk). In addition, the TIM 830may or may not have electrical conductivity. For example, when the TIM830 has electrical conductivity, the TIM 830 is capable of blockingelectrical noise or Electro-Magnetic Interference (EMI). Alternatively,the TIM 830 may have excellent abrasion resistance or heat resistance.Alternatively, the TIM 830 may contain a thermoplastic material.

The TIM 830 according to various embodiments may include a Phase ChangeMaterial (PCM). The PCM is changeable from a solid phase to a liquidphase by heat. Here, a liquid PCM may have viscosity. Alternatively, theliquid PIM may be compressible or incompressible. In addition, the TIM830 may include a material that changes at least one physical propertyby heat. For example, the TIM can have high viscosity by heat.

The TIM 830 according to various embodiments has a mechanical property(e.g., tensile strength or elasticity), may be resistant againsttearing, and may be cured upon being heated.

The TIM 830 according to various embodiments may be shaped in a mannerof performing a surface treatment with a thermally conductive material(e.g., silicon, silicone polymer, graphite, or acrylic). The surfacetreatment method may increase the bonding force between the top face ofthe TIM and the thermally conductive material. The TIM 830 according tovarious embodiments may contain silicone polymer.

The electronic device 800 according to various embodiments may have astructure in which the heat generation source 812, the TIM 830, and theheat collection device 860 are stacked in a vertical direction. Inaddition, at least a portion of the heat pipe 850 may be disposed to beaccommodated in the heat collection device 860. The heat generationsource 812 and the TIM 830 may be directly bonded to each other in avertically stacked structure, the TIM 830 and the heat collection device860 are directly bonded to each other in a stacked structure, the heatcollection device 860 and the heat pipe 850 may be directly bonded toeach other, and the heat collection device 860 including the heat pipe850 may be directly bonded to the inner support structure 820 (which mayalso be referred to as a mid-plate) so as to be accommodated. Instead ofthe direct bonding, stacking may be performed using soldering, anadhesive layer, or a mechanical bonding structure.

Hereinafter, a heat pipe mounting structure associated with a shieldingstructure will be described.

FIG. 9 is cross-sectional view illustrating an electronic device inwhich a heat transfer structure is applied to a shielding structureaccording to various embodiments of the present disclosure in a stackedform.

Referring to FIG. 9, an electronic device 900 according to variousembodiments may include a board 910, a heat generation source 912, ashielding structure 920, TIMs 930 and 932, and a heat pipe 950. Theelectronic device 900 according to various embodiments may be the sameas the electronic device 400 illustrated in FIG. 4. In addition, theheat pipe 950 according to various embodiments may be the same as theheat pipe 650 illustrated in FIG. 6.

The electronic device 900 according to various embodiments may have astructure in which heat generated from the heat generation source 912 istransferred by the heat pipe 950 through the TIMs 930 and 932. The heattransfer structure is applied to the shielding structure 920, so thatthe heat generated from the heat generation source 912 can betransferred to the heat pipe 950 via the shielding structure 920.

The board 910 according to various embodiments may include a first face910 a facing the first direction and a second face 910 b facing thesecond direction opposite the first face 910 a. The board 910 may havevarious electronic components mounted on each of the first and secondfaces 910 a and 910 b. When the electronic components are in operation,the board 910 may become a heat generation source. The heat generationsource 912 may be mounted on the first face 910 a of the board accordingto various embodiments. For example, the heat generation source 912 maybe of a chip type and may include an AP, a CP, a PA of an RF unit, orthe like.

The shielding structure 920 according to various embodiments may be adevice for shielding electromagnetic waves generated from the heatgeneration source 912 and may include a shield can for shielding EMI.The shielding structure 920 may be disposed to enclose the side facesand the top face of the heat generation source 912. The shieldingstructure 920 may include a shield frame 921 configured to enclose theside faces of the heat generation source 912 and a shield cover 922configured to cover the shield frame 921. The shield cover 922 may becoupled to close the top face of the shield frame 921. The shield cover922 may be a plate including a thin metal material and may include ashield film or a shield sheet. The shield cover 922 may include a metalmaterial, and may include a material such as copper that is excellent inthermal conductivity and is capable of preventing static electricity.

The TIM according to various embodiments may include a first TIM 930,which is a liquid phase or is near the liquid phase and a second TIM932, which is a solid phase or is near the solid phase.

The first TIM 930 according to various embodiments may be disposedbetween the top face of the heat generation source 912 and the bottomface of the shield cover 922. Since the first TIM 930 is a material,which is a liquid phase or is near the liquid phase, it is possible toincrease the degree of close contact with the top face of the heatgeneration source 912 compared with the second TIM 932, which is a solidphase. The top face of the heat generation source 912 and the first TIM930 should be in close contact with each other in order to increase thethermal conductivity, so that the heat generated from the heatgeneration source 912 can be transferred to the first TIM 930.

The second TIM 932 according to various embodiments may be disposedbetween the top face of the shield cover 922 and the bottom face of theheat pipe 950. The second TIM 932 may be a material, which is a solidphase or is near the solid phase, and may serve to transfer the heat,transferred from the shield cover 922, to the heat pipe 950. Inaddition, the second TIM 932 may transfer the heat, transferred from theshield cover 922, to the inner support bracket 940, thereby performingan additional transfer function. Because the inner support structure 940is a low temperature region, the heat, transferred from the second heattransfer material 932, can be transferred to the heat pipe 950 andtransferred to the inner support bracket 940. In addition, the heat,transferred to the inner support structure 940, can be transmitted backto the heat pipe 950. For example, the inner support structure 940 mayinclude a bracket.

In the electronic device 900 according to various embodiments, the firstTIM 930 may be bonded on the heat generation source 912 in a verticallystacked form, the shield cover 922 may be bonded on the first TIM 930 ina vertically stacked form, the second TIM 932 may be disposed on theshield cover 922 in a vertically stacked form, and the heat pipe 950 andthe inner support structure 940 may be disposed on the second TIM 932 ina vertically stacked form. Respective layers can be densely bonded toeach other. Reference numeral 952 may denote a piece of tape as anadhesive layer.

FIG. 10 is cross-sectional view illustrating an electronic device inwhich a shielding structure and a heat transfer structure according tovarious embodiments of the present disclosure are applied in a stackedform. Referring to FIG. 10, an electronic device 1000 according tovarious embodiments may be the same as the electronic device 400illustrated in FIG. 4. In addition, a heat pipe 1050 according tovarious embodiments may be the same as the heat pipe 650 illustrated inFIG. 6. A heat collection device 1060 according to various embodimentsof the present disclosure may be the same as each of the heat collectiondevices 760 and 860 illustrated in FIGS. 7 and 8.

The electronic device 1000 according to various embodiments may includea board 1010, a heat generation source 1012, a shielding structure 1020,a TIM 1030, a heat collection device 1060, and a heat pipe 1050.

The electronic device 1000 according to various embodiments may beconfigured such that heat, generated from the heat generation source1012, is transferred via the TIM 1030, the transferred heat is collectedby the heat collection device 1060, and then the collected heat istransferred by the heat pipe 1050. The heat transfer structure isapplied to the shielding structure 1020, so that the heat, generatedfrom the heat generation source 1012, can be transferred to the heatpipe 1050 via the shielding structure 1020 and the heat collectiondevice 1060.

The board 1010 according to various embodiments may include a first face1010 a facing the first direction and a second face 1010 b facing thesecond direction opposite the first face 1010 a. The board 1010 may havevarious electronic components mounted on each of the first and secondfaces 1010 a and 1010 b. The heat generation source 1012 may be mountedon the first face 1010 a of the board according to various embodiments.For example, the heat generation source 1012 may be of a chip type andmay include an AP, a CP, a PA of an RF unit, or the like.

The shielding structure 1020 according to various embodiments may be adevice for shielding electromagnetic waves generated from the heatgeneration source 1012 and may include a shield can for shielding EMI.The shielding structure 1020 may be disposed to enclose the side facesand the top face of the heat generation source 1012. The shieldingstructure 1020 may include a shield frame 1021 configured to enclose theside faces of the heat generation source 1012 and a shield cover 1022configured to cover the shield frame 1021. The shield cover 1022 may bea plate including a thin metal material and may be referred to as ashield film or a shield sheet. The shield cover 1022 may include a metalmaterial, and may include a material such as copper that is excellent inthermal conductivity and is capable of preventing static electricity.

The TIM 1030 according to various embodiments may be disposed betweenthe top face of the heat generation source 1012 and the bottom face ofthe shield cover 1022. The TIM 1030 may include a material, which is aliquid phase or is near the liquid phase, or a material, which is asolid phase or is near the solid phase. The top face of the heatgeneration source 1012 and the TIM 1030 should be in close contact witheach other in order to increase the thermal conductivity, so that theheat conductivity can be increased and the heat generated from the heatgeneration source 1012 can be transferred to the TIM 1030.

The heat collection device 1060 according to various embodiments may bedisposed between the top face of the shield cover 1022 and the bottomface of the heat pipe 1050. The heat collection device 1060 is able tocollect heat, transferred from the shield cover 1022, and to transferthe collected heat to the heat pipe 1050. In addition, the heatcollection device 1060 may transfer the heat, transferred from theshield cover 1022, to the inner support bracket 1040, thereby performingan additional transfer function. Because the inner support structure1040 is a low temperature region, the inner support structure 1040 isable to directly transfer the heat, transferred from the heat collectiondevice 1060, to the heat pipe 1050, and to transfer the heat to theinner support bracket 1040. In addition, the heat, transferred to theinner support structure 1040, can be transmitted back to the heat pipe1050. For example, the inner support structure 1040 may include abracket.

In the electronic device 900 according to various embodiments, the firstTIM 930 may be bonded on the heat generation source 912 in a verticallystacked form, the shield cover 922 may be bonded on the first TIM 930 ina vertically stacked form, the second TIM 932 may be disposed on theshield cover 922 in a vertically stacked form, and the heat pipe 950 andthe inner support structure 940 may be disposed on the second TIM 932 ina vertically stacked form. Respective layers can be densely bonded toeach other. Reference numeral 1052 denotes a thermally conductive tapewhich is an adhesive layer of the heat pipe 1050, and reference numeral1062 denotes a soldering portion or a solder layer for bonding the heatcollection device 1060 to the inner support structure 1040.

The heat collection device 1060 according to various embodiments may beconfigured such that a face thereof that faces the top face of the heatgeneration source 1012 is the same or slightly smaller than the top faceof the heat generation source 1012.

FIG. 11 is cross-sectional view illustrating an electronic device inwhich a heat transfer structure according to various embodiments of thepresent disclosure are applied to a shielding structure in a stackedform.

Referring to FIG. 11, an electronic device 1100 according to variousembodiments is different from the electronic device 1000 illustrated inFIG. 10 in the configuration of a TIP 1130, but is the same as theelectronic device 1000 in the remaining configuration. Thus,descriptions of the remaining configuration will be omitted. The TIM1130 according to various embodiments may be disposed between the topface of the heat generation source 1112 and the bottom face of theshield cover 1122.

The TIM 1130 according to various embodiments may be composed of a firstTIM 1131, which is a liquid phase or is near the liquid phase and asecond TIM 1132, which is a solid phase or is near the solid phase. TheTIM, which is the liquid phase or is near the liquid, is in closecontact with the other components, and is superior to the TIM, which isthe solid phase. On the other hand, the TIM, which is the solid phase,is superior in thermal conductivity to the TIM, which is the liquidphase, but is inferior in bonding force.

The electronic device 1100 according to various embodiments may employ amixed TIM 1130 for transferring heat to be transferred from the heatgeneration source 1112.

The top face of the heat generation source and the TIM 1030 should be inclose contact with each other in order to increase the thermalconductivity, so that the heat conductivity can be increased and theheat generated from the heat generation source 1112 can be transferredto the TIM 1030. Rather than a solid TIM, a liquid TIM may be placed onthe top face of the heat generation source. For high thermalconductivity, the layer thickness of the second TIM 1132 may beconfigured to be greater than the layer thickness of the first TIM 1131.

FIG. 12 is cross-sectional view illustrating an electronic device inwhich a heat transfer structure and a shielding structure according tovarious embodiments of the present disclosure are applied in a stackedform.

Referring to FIG. 12, an electronic device 1200 according to variousembodiments is different from the electronic device 1000 illustrated inFIG. 10 in the configuration of a shielding structure 1220, but is thesame as the electronic device 1000 in the remaining configuration. Thus,descriptions of the remaining configuration will be omitted.

The shielding structure 1220 according to various embodiments may have astructure that encloses the side faces and the top face of the heatsource 1212 with a shield cover 1222. For example, the shield cover 1222may be constituted by a shield film so as to close the heat generationsource 1212 by the portion thereof located on the top face 1221 of theheat generation source 1212 as well as portions 1221 located at thelateral sides of the heat generation source 1212. The end portions 1223of the shielding structure 1220 can be fixed using a fastening structureusing fasteners not illustrated or welding on the board 1210.

FIG. 13 is cross-sectional view illustrating an electronic device inwhich a shielding structure and a heat transfer structure according tovarious embodiments of the present disclosure are applied in a stackedform.

Referring to FIG. 13, an electronic device 1300 according to variousembodiments may be the same as the electronic device 400 illustrated inFIG. 4. In addition, a heat pipe 1350 according to various embodimentsmay be the same as the heat pipe 650 illustrated in FIG. 6.

An electronic device 1300 according to various embodiments may include aboard 1310, a heat generation source 1312, a heat collectiondevice/shielding structure 1320, a TIM 1330, and a heat pipe 1350.

The electronic device 1300 according to various embodiments may beconfigured such that heat, generated from the heat generation source1312, is transferred via the TIM 1330, the transferred heat is collectedby the heat collection device/shielding structure 1330, and then thecollected heat is transferred by the heat pipe 1350.

The heat collection device/shielding structure 1320 according to variousembodiments may include a metal material, and may serve to shield theEMI generated from the board 1310 and to collect heat generated from theheat generation source. For example, the heat collectiondevice/shielding structure 1320 may provide a structure for performingthe functions of the heat collection device and the shielding structureillustrated in FIG. 10.

The electronic device 1300 according to various embodiments may beconfigured such that heat, generated from the heat generation source1312, can be transferred and collected by the heat collectiondevice/shielding structure 1320, and can be directly transferred to theheat pipe 1350. The heat collection device/shielding structure 1320according to various embodiments may include a shield frame 1321 and aheat collection device/shield cover 1322.

The heat collection device/shielding structure 1320 according to variousembodiments may be disposed to enclose the side faces and the top faceof the heat generation source 1312. The shield cover 1322 is a thinmetal plate, and may include a shield film or a shield sheet. The shieldcover 1322 includes a metal material and is excellent in thermalconductivity.

The TIM 1330 according to various embodiments may be disposed betweenthe top face of the heat generation source 1312 and the bottom face ofthe heat collection device/shield cover 1322. The TIM 1330 may becomposed of a material, which is a liquid phase or is near the liquidphase, or a material, which is a solid phase or is near the solid phase.The top face of the heat generation source 1312 and the TIM 1330 shouldbe in close contact with each other in order to increase the thermalconductivity, so that the heat conductivity can be increased and theheat generated from the heat generation source 1012 can be transferredto the TIM 1030.

The heat collection device/shield cover 1322 according to variousembodiments may serve to collect the heat transferred from the heattransfer material 1330 and to transfer the collected heat to the heatpipe 1350. The heat collection device/shield cover 1322 is able totransfer the transferred heat to the inner support bracket 1340. Becausethe inner support structure 1340 is a low temperature region, the innersupport structure 1340 is able to transfer the heat, transferred fromthe heat collection device/shield cover 1322, to the heat pipe 1350, andto transfer the heat to the inner support bracket 1340. In addition, theheat, transferred to the inner support structure 1340, can betransmitted back to the heat pipe 1350.

In the electronic device 1300 according to various embodiments, the TIM1330 may be bonded on the heat generation source 1312 in a verticallystacked form, the heat collection device/shield cover 1322 may be bondedon the TIM 1330 in a vertically stacked form, the heat pipe 1350 and theinner support structure 1340 may be disposed on the heat collectiondevice/shield cover 1322 in a vertically stacked form. Respective layerscan be densely bonded to each other. Reference numeral 1352 denotes athermally conductive tape which is an adhesive layer of the heat pipe1350, and reference numeral 1362 denotes a soldering portion or a solderlayer for bonding the heat collection device/shield cover 1322 to theinner support structure 1340.

FIG. 14 is cross-sectional view illustrating an electronic device inwhich a heat transfer structure is applied to a shielding structureaccording to various embodiments of the present disclosure in a stackedform.

Referring to FIG. 14, the electronic device 1400 according to variousembodiments may be the same as the electronic device illustrated inFIGS. 1A to 1C. An electronic device 1400 according to variousembodiments may include a board 1410, first and second heat generationsources 1411 and 1412, first and second shielding structures 1421 and1422, first to fourth TIMs 1431 to 1434, and a heat pipe 1450. Each ofthe first and second shielding structures 1421 and 1422 according tovarious embodiments of the present disclosure may be the same as theshielding device 1020 illustrated in FIG. 10. In addition, a heat pipe1450 according to various embodiments may be the same as the heat pipe650 illustrated in FIG. 6.

The electronic device 1400 according to various embodiments may beconfigured such that heat, generated from the first heat generationsource 1411, is transferred to the first shielding structure 1421 viathe first TIM 1431, and is transferred to the heat pipe 1450 by thefourth TIM 1434. The electronic device 1400 according to variousembodiments may be configured such that heat, generated from the secondheat generation source 1412, is transferred to the second shield cover1426 by the second TIM 1432, and the heat, transferred to the secondshield cover 1426, is transferred to the fourth TIM 1434 via the thirdTIM 1433 and is transferred to the heat pipe 1450 by the fourth TIM1434.

The board 1410 according to various embodiments may include a first face1410 a facing the first direction and a second face 1410 b facing thesecond direction opposite the first face 1410 a. The board 1410 may havevarious electronic components mounted on each of first and second faces1410 a and 1410 b. The first heat generation source 1411 may be disposedon the first face 1410 a of the board and the second heat generationsource 1412 may be disposed on the second face 1410 b of the board. Forexample, each of the first and second heat generation sources 1411 and1412 may be of a chip type and may include an AP, a CP, a PA of an RFunit, or the like.

The first and second shielding structures 1421 and 1422 according tovarious embodiments may be devices for shielding electromagnetic wavesgenerated from the first and second heat generation sources 1411 and1412, respectively, and may each include a shield can for shielding EMI.The first and second shielding structures 1421 and 1422 may be disposedto enclose the side faces and the top face of the first and second heatgeneration sources 1411 and 1412, respectively.

The first shielding structure 1421 according to various embodiments mayinclude a first shield frame 1423 configured to enclose the side facesof the first heat generation source 1411 and a first shield cover 1424configured to cover the first shield frame 1423. The first shield cover1424 may be coupled to close the top face of the first shield frame1423. The first shield cover 1424 is a thin metal plate, and may includea shield film or a shield sheet. The first shield cover 1424 may includea metal material, and may include a material such as copper that isexcellent in thermal conductivity and is capable of preventing staticelectricity.

The second shielding structure 1422 according to various embodiments mayinclude a second shield frame 1425 configured to enclose the side facesof the second heat generation source 1412 and a second shield cover 1426configured to cover the second shield frame 1425. The second shieldcover 1426 may be coupled to close the top face of the second shieldframe 1425. The second shield cover 1426 is a thin metal plate, and mayinclude a shield film or a shield sheet. The second shield cover 1426may include a metal material, and may include a material such as copperthat is excellent in thermal conductivity and is capable of preventingstatic electricity.

The first to fourth TIMs 1431 to 1434 according to various embodimentsmay include a TIM 930, which is a liquid phase or is near the liquidphase, a TIM 932, which is a solid phase or is near the solid phase, ora combination thereof.

The first TIM 1431 according to various embodiments may be disposedbetween the top face and a side face of the first heat generation source1411 and the bottom face of the first shield cover 1424 and the firstshield frame 1423. The first TIM 1431 may be filled in the spaceenclosed by the first heat generation source 1411, the first shieldcover 1424, and the first shield frame 1423. The heat, generated fromthe first heat source 1411, is transferred to the first shield cover1424 and the first shield frame 1423, and the heat, transferred to thefirst shield frame 1423, is transferred to the fourth TIM 1434 and isfinally transferred to the heat pipe 1450. Although not illustrated inthe drawings, the first shield cover 1424 may be configured such thatheat may be transferred to the internal support structure.Alternatively, although not illustrated, the heat pipe 1450 may furtherinclude a heat collection device.

The second TIM 1432 according to various embodiments may be disposedbetween the top face of the second heat generation source 1412 and thesecond shield cover 1426. The heat, generated from the second heatgeneration source 1412, may be transferred to the second shield cover1426 by the second TIM 1432.

The third TIM 1433 according to various embodiments may be filled in thespace between the bottom face of the second shield cover 1426 and thesecond shield framer 1425. The third TIM 1433 filled in the space may bedivided into two portions. A first portion 14331 may be a portionattached to the second shield cover 1426 and a second portion 14332 maybe a portion disposed between the second shield frame 1425 and thefourth TIM 1434. The heat, transferred from the second shield cover1426, is transferred to the second portion 14332 via the first portion14331, and the heat, transferred to the second portion 14332, istransferred to the fourth TIM 1434 and is finally transferred to theheat pipe 1450.

The fourth TIM 1434 and the heat pipe 1450 according to variousembodiments may be heat transfer paths for transferring heat to thelateral sides of the first heat generation source 1411, the second heatgeneration source 1412, or the first and second heat sources 1411 and1412. The fourth TIM 1434 may laterally extend with respect to the firstand second heat generation sources 1411 and 1412, so that the fourth TIM1434 is able to transfer the heat, transferred thereto, to the heat pipe1450 disposed to laterally face the fourth TIM 1434.

The electronic device 140 according to various embodiments may beconfigured such that a first heat transfer structure disposed in thefirst shielding structure 1421 of the first face 1401 a of the board isdisposed to be symmetrical to the second shielding structure 1422 of thesecond face of the board, and a second heat transfer structure disposedin the second shielding structure 1422 of the second face 1410 b of theboard may be disposed to be symmetrical to the first shielding structure1421 of the first face 1410 a of the board.

FIG. 15 is a perspective view illustrating a board to which a heat pipeis applied in a lateral direction of a shielding structure according tovarious embodiments of the present disclosure.

Referring to FIG. 15, an electronic device 1500 according to variousembodiments may be the same as the electronic device 100 illustrated inFIGS. 1A to 1C. The electronic device 1500 according to variousembodiments may include a board 1510, a plurality of shieldingstructures 1521 to 1523 mounted on a first face of the board 1510, and aheat pipe 1550 disposed on a side face of each of the shieldingstructures 1521 to 1523 so as to be connected to each of the shieldingstructures 1521 to 1523. The plurality of shielding structures 1521 to1523 may be mounted on the first face of the board 1510 according tovarious embodiments, and each of the shielding structures 1521 to 1523may be disposed to be spaced apart from each other. The shieldingstructures 1521 to 1523 may be disposed to be in contact with eachother. The heat, generated from respective shield structures 1521 to1523, can be transmitted to one heat pipe 1550. The heat pipe 1550 maybe bonded to respective shielding structures 1521 to 1523 through asoldering process. The temperature of each of the shielding structures1521 to 1523 can be lowered downward by the heat pipe 1550.

FIG. 16A is a perspective view illustrating a heat collection deviceaccording to various embodiments of the present disclosure. FIG. 16B isa plan view illustrating a state in which a portion of the heat pipe iscoupled to the heat collection device according to various embodimentsof the present disclosure.

Referring to FIGS. 16A and 16B, a heat collection device 1660 accordingto various embodiments may be the same as the heat collection devices860 illustrated in FIG. 8 and the heat collection device 1060illustrated in FIG. 10. The heat collection device 1660 according tovarious embodiments may be configured to have a surface that faces thetop face of the heat generation source, particularly a surface having asize similar to that of the top face of the heat generation source, andmay have a plate shape including a metal having a high thermalconductivity similar to that of copper.

The heat collection device 1660 according to various embodiments mayinclude a first end 1651 of a heat pipe 1650 and a recess 1662 to whichthe first end 1651 is coupled. The recess 1662 is formed in a shapedepressed with a predetermined depth from the top face of the heatcollection device 1660, and a portion of the heat pipe may be insertedinto the recess and may be bonded through a soldering process or using adouble-sided tape (not illustrated) having a high thermal conductivity.

Various bonding structures between the heat pipe and the heat collectiondevice according to various embodiments will be described with referenceto FIGS. 17A to 17D.

FIG. 17A is a cross-sectional view illustrating a state in which aportion of a heat pipe 1750 is bonded to an inner support structure 1740according to various embodiments of the present disclosure.

Referring to FIG. 17A, the heat pipe 1750 according to variousembodiments may be bonded to the recess formed in the inner supportstructure 1740 using a double-sided tape 1750 b having a high thermalconductivity. Instead of the double-sided tape 1750 b having a highthermal conductivity to be used as a bonding material, the heat pipe1750 and the inner support structure 1740 may be bonded to each otherthrough a soldering process. When the heat pipe 1740 is coupled to therecess of the inner support structure 1750, the top face 1750 a of theheat pipe may be approximately coplanar with the top face 1740 a of theinner support structure. Respective mating faces on the heat pipe 1750according to various embodiments may be in intimate contact withrespective mating faces formed in the recess. For example, when a spaceexists between the respective mating faces on the heat pipe 1750 and therespective mating faces formed in the recess, the heat transferefficiency may be reduced. Thus, an empty space can be filled with aheat transfer material such as solder.

FIG. 17B is a cross-sectional view illustrating a state in which aportion of the heat pipe 1751 is bonded to the inner support structure1741 according to various embodiments of the present disclosure.

Referring to FIG. 17B, the heat pipe 1751 according to variousembodiments may be bonded to the recess formed in the inner supportstructure 1741 using a double-sided tape 1751 b having a high thermalconductivity. Instead of the double-sided tape 1751 b having a highthermal conductivity to be used as a bonding material, the heat pipe1751 and the inner support structure 1741 may be bonded to each otherthrough a soldering process. When the heat pipe 1751 is coupled to therecess of the inner support structure 1741, the top face 1751 a of theheat pipe may be disposed to slightly protrude from the top face 1741 aof the inner support structure.

FIG. 17C is a cross-sectional view illustrating a state in which aportion of the heat pipe 1752 is bonded to the inner support structure1742 according to various embodiments of the present disclosure.

Referring to FIG. 17C, the heat pipe 1752 according to variousembodiments may be bonded to the recess formed in the inner supportstructure 1742 using a PCM sheet 1752 b. When the heat pipe 1752 iscoupled to the recess of the inner support structure 1742, the top face1752 a of the heat pipe may be approximately coplanar with the top face1742 a of the inner support structure. Respective mating faces on theheat pipe 1752 according to various embodiments may be in intimatecontact with respective mating faces formed in the recess. For example,when a space exists between the respective mating faces on the heat pipe1752 and the respective mating faces formed in the recess, the heattransfer efficiency may be reduced. Thus, an empty space can be filledwith a heat transfer material such as solder.

FIG. 17C is a cross-sectional view illustrating a state in which aportion of the heat pipe 1753 is bonded to the inner support structure1743 according to various embodiments of the present disclosure.

Referring to FIG. 17D, the heat pipe 1753 according to variousembodiments may be fabricated integrally with the inner supportstructure 1743. When the inner support structure 1743 is manufacturedthrough a die casting process or an injection process, the heat pipe1753 may be integrally formed in the inner support structure 1743through the methods described above.

FIG. 18A is a cross-sectional view illustrating a state in which aportion of a heat pipe 1850 is bonded to a heat collection device 1860according to various embodiments of the present disclosure.

Referring to FIG. 18A, the heat pipe 1850 according to variousembodiments may be bonded to a recess formed in the heat collectiondevice 1860 through a soldering process. When the heat pipe 1850 isbonded to the recess of the heat collection device 1860, the top face1850 a of the heat pipe 1850 may be approximately coplanar with the topface 1860 a of the heat collection device. Respective mating faces onthe heat pipe 1850 according to various embodiments may be in intimatecontact with respective mating faces formed in the recess.

FIG. 18B is a cross-sectional view illustrating a state in which aportion of the heat pipe 1852 is bonded to the heat collection device1862 according to various embodiments of the present disclosure.

Referring to FIG. 18B, the heat collection device 1862 according tovarious embodiments has a recess formed therein, and an engagementstructure 18621 is formed in the recess, so that the heat collectiondevice 1862 can be tightly coupled without using a material, which isexcellent in adhesive force and thermal conductivity. When the heat pipe1852 is coupled to the recess of the heat collection device 1862, thetop face 1852 a of the heat pipe may be disposed to be slightlydepressed from the top face 1862 a of the heat collection device.

FIG. 19A is a plan view illustrating a state in which a heat pipe iscoupled to a display reinforcement plate according to variousembodiments of the present disclosure. FIG. 19B is a cross-sectionalview taken along line A-A in FIG. 19A.

Referring to FIGS. 19A and 19B, an electronic device 1900 according tovarious embodiments may be the same as the electronic device 100illustrated in FIGS. 1A to 1C. The electronic device 1900 according tovarious embodiments may include a display 1910 disposed on a first faceof a housing to be exposed and a heat pipe 1920. The display 1910 mayinclude a display module 1910 and a reinforcement plate 1921 thatsupports the display module 1910. For example, the reinforcement plate1912 may be made of a metal material so as to resist the distortion ofthe display module 1910 or the like. The heat pipe 1920 may beintegrally coupled to the reinforcement plate 1912. The heat,transferred from the heat source, can be transferred to thereinforcement plate 1912 through the heat pipe 1920.

FIG. 20A is a plan view illustrating a state in which a heat pipe iscoupled to a rear cover according to various embodiments of thedisclosure. FIG. 20B is a cross-sectional view taken along line B-B inFIG. 20A.

Referring to FIGS. 20A and 20B, an electronic device 2000 according tovarious embodiments may be the same as the electronic device 100illustrated in FIGS. 1A to 1C. The electronic device 2000 according tovarious embodiments may include a rear cover 2010 and a heat pipe 2020.The rear cover 2010 may be referred to as a battery cover or anaccessory cover. The rear cover 2010 may be configured on the rear caseof the electronic device in an integrated type or a removably mountingtype. The rear cover 2010 may be constituted with a plasticinjection-molded product material and may be detachably mounted on therear case. Further, the rear cover 2010 may be constituted with an outermetal case and may be integrated with the electronic device.

The heat pipe 2020 according to various embodiments may be coupled tothe rear cover 2010 or may be manufactured integrally with the rearcover 2010. When the rear cover 2010 is a plastic injection-moldedproduct, the metal heat pipe 2020 may be manufactured through adouble-injection molding method. When the rear cover 2010 is made of ametal material, the heat pipe 2020 may be integrally formed during themanufacturing of the rear cover. The heat pipe 2020 may be formed on theinner face 2010 a of the rear cover, which is close to or faces the heatgeneration source of the electronic device.

FIG. 21 is a plan view illustrating a state in which a heat pipe iscoupled to a rear case according to various embodiments of thedisclosure.

Referring to FIG. 21, an electronic device 2100 according to variousembodiments may have at least one heat pipe 2120 formed in a rim portion(peripheral edge) of a rear case 2110. A recess is formed in the rearcase 2110, and a heat pipe 2120 may be coupled to the formed recess.Since the rear case 2110 is made of a plastic material and the heat pipe2120 is made of a metal material, the heat pipe 2120 may be manufacturedin the rear case 2110 through an insert injection molding method.Furthermore, the heat pipe 2120 coupled to the rear case 2110 is able toperform a heat transfer function as well as to serve as a skeleton(frame) of the rear case 2110. The heat transferred to the heat pipe2120 can be transmitted to the rim portion 2130 of the housing.

The rim portion 2130 according to various embodiments may be constitutedwith a metal frame, and may serve as an antenna radiator. In addition,the heat pipe 2120 is coupled to the rim portion 2130, so that a heattransfer function can be performed.

FIG. 22A is a view illustrating a state in which a heat pipe is disposedin first and second accommodation recesses according to variousembodiments of the disclosure. FIG. 22B is a cross-sectional viewillustrating the state in which the heat pipe is disposed in the firstand second accommodation recesses according to various embodiments ofthe disclosure.

Referring to FIGS. 22A and 22B, an electronic device 2200 according tovarious embodiments may include first and second accommodation recesses2222 and 2224 so as to bond a heat pipe 2250 to a support structure2220. A first portion 2252 of the heat pipe 2250 may be disposed in thefirst accommodation recess 2222 and the second portion 2254 of the heatpipe 2250 may be disposed in the second accommodation recess 2224. Theheat pipe 2250 may be disposed in the first and second accommodationrecesses 2222 and 2224 and the disposed heat pipe 2250 may be fixedlybonded to the first and second accommodation recesses 2222 and 2224through soldering. Each of the first and second accommodation recesses2222 and 2224 may be formed through a cutting-off operation of thesupport structure 2220.

The first accommodation recess 2222 according to various embodiments mayenclose the first portion 2252 of the heat pipe, and the bottom of thefirst accommodation recess 222 may be configured in a stepped shape. Forexample, a plurality of first steps 2222 a may be formed on the bottomof the first accommodation recess 2222. The contact faces between theheat pipe 2250 and the support structure 2220 can be increased by thefirst steps 2222 a. The thermal conductivity to the support structurecan be improved by the stepped first accommodation recess 2222.

The second accommodation recess 2224 according to various embodimentsmay enclose the second portion 2254 of the heat pipe, and the bottom ofthe second accommodation recess 222 may be configured in a steppedshape. For example, a plurality of second steps 2224 a may be formed onthe bottom of the second accommodation recess 2224. The contact facesbetween the heat pipe 2250 and the support structure 2220 can beincreased by the second steps 2224 a. The thermal conductivity to thesupport structure can be improved by the stepped second accommodationrecess 2224.

FIG. 23A is a view illustrating a state in which a plurality ofshielding structures according to various embodiments of the presentdisclosure is provided with a heat dissipation structure using a clipand a heat pipe. FIG. 23B is a perspective view illustrating a state inwhich the clip is coupled between first and second shielding structuresaccording to various embodiments of the present disclosure.

Referring to FIGS. 23A and 23B, an electronic device 2300 according tovarious embodiments includes a heat transfer path, which may be formedin a plurality of shielding structures 2340 to 2342 using one heat pipe2350 and at least one clip 2360.

The substrate 2310 according to various embodiments may include, on afirst face thereof, first to third heat generation elements 2312, 2313,and 2314 and first to third shielding structures 2340, 2341, and 2342,which are mounted on the first to third heat generation elements 2312,2313, and 2314, respectively. The first heat generation element 2312 isenclosed by the first shielding structure 2340, the second heatgeneration element 2313 is enclosed by the second shielding structure2341, and the third heat generation element 2314 is enclosed by thethird shielding structure 2342. The respective first to third shieldingstructures 2340 to 2342 may be disposed on the board 2310 to be spacedapart from each other.

The first and second shielding structures 2340 and 2341 according tovarious embodiments may be physically and electrically connected to eachother using the first clip 2360, and the second and third shieldingstructures 2341 and 2342 may be physically and electrically connected toeach other using the second clip 2361. The first clip 2360 is insertedinto a coupling opening 2345 formed by the first and second shieldingstructures 2340 and 2341, so that the heat pipe 2350 can be placed inclose contact with the side faces of the first and second shieldingstructures 2340 and 2341. The second clip 2361 is inserted into acoupling opening (not illustrated) formed by the second and thirdshielding structures 2341 and 2342, so that the heat pipe 2350 can beplaced in close contact with the side faces of the second and thirdshielding structures 2341 and 2342.

The heat pipe 2350 according to various embodiments may be disposedbetween the side faces of the first, second, and third shieldingstructures 2340 to 2342 and the first and second clips 2360 and 2361, sothat heat, generated from each of the first, second, and third heatgeneration elements 2312, 2313, and 2314, can be transferred to thesupport structure 2320. The coupling position of each of the first andsecond clips 2360 and 2361 may be, but not exclusively, located betweenthe first and second shielding structures 2340 and 2341. Referencecharacter B denotes a battery pack.

FIG. 24 is a cross-sectional view illustrating a state in which each offirst and second faces of a board according to various embodiments ofthe present disclosure is provided with a heat dissipation structure.

Referring to FIG. 24, an electronic device 2400 according to variousembodiments includes a first heat transfer path, which may be formed ina plurality of first shielding structures 2440 using a first heat pipe2450 and at least one first clip 2460 on a first face of a board 2410.The electronic device 2400 according to various embodiments includes asecond heat transfer path, which may be formed in a plurality of secondshielding structures 2345 using a second heat pipe 2452 and at least onesecond clip 2462. Each of the first and second heat transfer paths mayhave the same structure as the heat transfer path illustrated in FIGS.23A and 23B.

The first and second heat transfer paths according to variousembodiments may be disposed symmetrically or asymmetrically on the firstand second faces of the board 2410, respectively.

Although not illustrated in the drawings, two or three heat pipes may bearranged in a parallel type or a non-overlapping type in a single heatgeneration element so as to provide a heat dissipation structure.

FIG. 25 is a cross-sectional view illustrating the structure of a PBA,which is provided with a heat dissipation structure according to variousembodiments of the present disclosure.

Referring to FIG. 25, an electronic device 2500 having a heatdissipation structure according to various embodiments may bemanufactured through the following method.

A heat generation element 2512 (having a thickness of about 1.15 to 1.3mm) and a shielding structure 2540 (having a height of about 1.5 to 1.54mm) may be mounted on a first face of a board 2510, a liquid TIM 2530(having a thickness of about 1.3 to 1.4 mm) may be coated on the topface of the heat generation element 2512, and then a cover 2542 (havinga thickness of about −0.04 to 0.06 mm) may be coupled onto the shieldingstructure 2540, thereby completing a primary heat dissipation structure.A vertical portion of the shielding structure 2540 may have a thicknessof about 0.1 mm and a horizontal portion may have a thickness of about0.15 mm.

A heat pipe 2550 may be attached to the support structure 2520 using adouble-sided tape. A PBA having a heat dissipation structure may beformed in the sequence of attaching the solid TIM 2560 (having athickness of about 0.15-0.25 mm) to the heat pipe 2550 attached to thesupport structure 2520, and attaching the solid TIM to the cover 2542.

FIG. 26 is a cross-sectional view illustrating a structure of a PBA,which is provided with a heat dissipation structure according to variousembodiments of the present disclosure.

Referring to FIG. 26, an electronic device 2600 having a heatdissipation structure according to various embodiments may bemanufactured through the following method.

A heat generation element 2612 (having a thickness of about 1.15 to 1.3mm) and a shielding structure 2640 (having a height of about 1.5 to 1.54mm) may be mounted on a first face of a board 2610.

A heat pipe 2650 may be attached to a support structure 2620 using adouble-sided tape. A module of the heat pipe 2650 attached to thesupport structure 2620 may be bonded to a copper plate 2660 (having athickness of about 1.13 to 1.17 mm) to through a soldering process.Subsequently, a solid TIM 2630 and a conductive tape 2642 (having athickness of 0.02 to 0.04 mm) may be attached to the copper plate 2660.Subsequently, a PBA having a heat dissipation structure may bemanufactured in the sequence of attaching the module of the heat pipe2650, to which the solid TIM material 2630 and the conductive tape 2642are attached, to the shielding structure 2640 using the conductive tape2642 at the time of coupling the support structure 2640 and the board2610.

FIG. 27 is an exemplary view illustrating a disposed state of a heatpipe to which a heat collection/diffusion device according to variousembodiments of the present disclosure is coupled.

Referring to FIG. 27, the heat pipe 2750 according to variousembodiments may be at least partially the same as the heat pipe 450illustrated in FIGS. 4 and 5. The heat transfer structure illustrated inFIG. 27 may be at least partially or entirely equally applied to theshielding structures of the electronic devices illustrated in FIGS. 9 to14.

The heat pipe 2750 according to various embodiments may include first tothird portions 2750 a to 2750 c corresponding to the first to third heatgeneration components P1 to P3. The first portion 2750 a may be one endportion of the heat pipe 2750, the third portion 2750 c may be the otherend portion of the heat pipe 2750, and the second portion 2750 b may bea portion of the heat pipe 2750 located between the first and thirdportions 2750 a and 2750 c.

The heat pipe 2750 according to various embodiments may be configured invarious shapes, for example, in a linear shape, a curved shape, or acombination of linear and curved shapes. The length of the heat pipe2750 may be adjusted depending on the relative positions of the first tothird heat generation components P1 to P3, and the width or thickness ofthe heat pipe 2750 may be adjusted depending on the size of each of thefirst to third heat generation components P1 to P3.

The heat pipe 2750 and the first and second heat collection/diffusiondevices 2760 and 2761 may be disposed on the first to third heatgeneration components P1 to P3 mounted on the electronic device, so thatheat of the first to third heat generation components can be transferredto a relatively low temperature region and can be diffused to theperiphery. The heat pipe 2750 according to various embodiments may beformed to have a flat shape in cross section in order to maximize thebonding face with the heat generation source (e.g., the heat generationcomponents.

The electronic device according to various embodiments may include aplurality of heat generation elements. For example, the plurality ofheat generation components disposed in the electronic device may includea printed circuit board on which a plurality of electronic components isdisposed, and may include respective electronic components disposed onthe printed circuit board. For example, the heat generation componentsmay include a heat generation component such as a PAM, an AP, or amemory, which emits heat according to an operation mode of theelectronic device among the plurality of electronic components disposedon the printed circuit board. For the convenience of explanation, it isassumed that a PAM or an IF PMIC is a first heat generation componentP1, an AP is a second heat generation component P2, and a memory is athird heat generation component P3. The first heat generation componentP1 may be disposed close to the first portion 2750 a of the heat pipe2750, the second heat generation component P2 may be disposed close tothe second portion 2750 b, and the third heat generation component P3may be disposed close to the third portion 2750 c. The first to thirdheat generation components P1 to P3 may respectively operate atdifferent heat generation temperatures depending on the operation modeof the electronic device.

The heat collection/diffusion device according to various embodimentsmay include a plurality of heat collection/diffusion members coupled tothe heat pipe 2750. Although FIG. 27 illustrates an example in which twosingle heat collection/diffusion members 2760 and 2761 are disposed onthe heat pipe 2750, one or three or more heat collection/diffusionmembers may be disposed along the heat pipe 2750.

The heat collection/diffusion device according to various embodimentsmay include first and second heat collection/diffusion members 2760 and2761. The first heat generation component P1 may be disposed adjacent tothe first heat collection/diffusion member 2760. One or more heatgeneration components, e.g., the second and third heat generationcomponents P2 and P3 may be disposed adjacent to the second heatcollection/diffusion member 2761.

The heat collection/diffusion device according to various embodimentsmay perform a heat collection function in a first mode and a heatdiffusion function in a second mode. In addition, in a third mode, aportion of the heat collection/diffusion device may perform the heatcollection function and the remaining portion may perform the heatdiffusion function, or in a fourth mode, a portion of the heatcollection/diffusion device may perform the heat diffusion function andthe remaining portion may perform the heat collection function. Heatcollection may mean the function of collecting the heat transferred fromheat generation components, and thermal diffusion may mean the functionof diffusing the heat to the periphery.

The electronic device according to various embodiments may operate invarious modes. For example, the electronic device may operate in acommunication mode, a camera operation mode, a game mode, and the like.Depending on respective modes, the heat generation temperatures of thefirst to third heat generation components may be different from eachother. For example, in the communication mode of the electronic device,the first heat generation component (e.g., a PAM (or an IF PMIC) may bea hot zone region having the highest temperature, and in the cameraoperation mode or the game mode, the second heat generation component(e.g., an AP) may be the hot zone region having the highest temperature.In other words, the heat generation temperatures of respective heatgeneration components may be different from each other depending on theoperation mode of the electronic device. The third heat generationcomponent may have a temperature, which is lower than that of the firstand second heat generation components, or which is between the first andsecond heat generation components.

In the communication mode of the electronic device, since the first heatgeneration component P1 is the hot zone region having the highesttemperature, the heat generated from the first heat generation componentP1 can be collected by the first heat collection/diffusion member 2760,and the collected heat can be transferred to the heat pipe 2750 having arelatively low temperature. Subsequently, the heat, transferred to theheat pipe 2750 can be diffused by the second heat collection/diffusionmember 2761 to a peripheral region having a relatively low temperature.

In the camera operation mode of the electronic device (e.g., a videophotographing mode), since the second heat generation component P2 isthe hot zone region having the highest temperature, the heat, generatedfrom the second heat generation component P1, can be collected by aportion of the second heat collection/diffusion member 2761, and thecollected heat can be transferred to the heat pipe 2750 having arelatively low temperature. Subsequently, the heat, transferred to theheat pipe 2750 can be diffused by the first heat collection/diffusionmember 2760 to a peripheral region having a relatively low temperature,and can be diffused to another portion of the second heatcollection/diffusion member.

Depending on the operation mode of the electronic device, i.e.,depending on the temperature difference between the first to third heatgeneration components P1 to P3, each of the first and second heatcollection/diffusion members 2760 and 2761 may serve to collect heat orto diffuse heat.

FIG. 28 is an exemplary view illustrating a disposed state of a heatpipe to which a heat collection/diffusion device according to variousembodiments of the present disclosure is coupled.

Referring to FIG. 28, a heat pipe 2850 according to various embodimentsmay be coupled with a single heat collection/diffusion member 2860 so asto configure a heat transfer structure of a heat generation component.The heat pipe 2850 according to various embodiments may be at leastpartially the same as the heat pipe 450 illustrated in FIGS. 4 and 5.The heat transfer structure of the heat generation component accordingto various embodiments may be at least partially or entirely equallyapplied to the shielding structures of the electronic devicesillustrated in FIGS. 9 to 14.

The heat collection/diffusion member 2860 according to variousembodiments may be configured to have a size capable of sufficientlyenclosing the entire heat pipe 2850. The heat collection/diffusionmember 2860 may include a first portion 2861 disposed adjacent to thefirst heat generation component P1, a second portion 2862 disposedadjacent to the second heat generation component P2, and a third portion2863 disposed adjacent to the third heat generation component P3. Thefirst, second, and third portions 2861 to 2863 may be fabricated in anintegrated form. For the convenience of explanation, it is assumed thata PAM or an IF PMIC is a first heat generation component P1, an AP is asecond heat generation component P2, and a memory is a third heatgeneration component P3.

In the communication mode of the electronic device, since the first heatgeneration component P1 is the hot zone region having the highesttemperature, the heat, generated from the first heat generationcomponent P1, can be collected by the first portion 2861 of the heatcollection/diffusion member 2861, and the collected heat can betransferred to the heat pipe 2862 and the second portion 2862, whichhave a relatively low temperature. Subsequently, the heat, transferredto the heat pipe 2850 can be diffused by the heat collection/diffusionmember 2860 to a peripheral region, which has a relatively lowtemperature.

In the camera operation mode of the electronic device (e.g., a videophotographing mode), since the second heat generation component P2 isthe hot zone region having the highest temperature, the heat, generatedfrom the second heat generation component P2, can be collected by thesecond portion of the heat collection/diffusion member 2862, and thecollected heat can be diffused to each of the heat pipe 2850 and theother first and third portions 2861 and 2863, which have a relativelylow temperature.

Depending on the operation mode of the electronic device, i.e.,depending on the temperature difference between the first to third heatgeneration components P1 to P3, each of the first to third portions 2861to 2863 of each heat collection/diffusion member may serve to collectheat or to diffuse heat.

FIG. 29 is an exemplary view illustrating a disposed state of a heatpipe to which a heat collection/diffusion device according to variousembodiments of the present disclosure is coupled.

Referring to FIG. 29, a heat pipe 2950 according to various embodimentsmay be coupled with a plurality of heat collection/diffusion member 2960to 2963 so as to configure a heat transfer structure of first to thirdheat generation components P1 to P3. The heat pipe 2950 according tovarious embodiments may be at least partially the same as the heat pipe450 illustrated in FIGS. 4 and 5. The heat transfer structure of theheat generation component according to various embodiments may be atleast partially or entirely equally applied to the shielding structuresof the electronic devices illustrated in FIGS. 9 to 14.

The heat collection/diffusion device according to various embodimentsmay include first to third heat collection/diffusion members 2960 to2962, which are disposed in the heat pipe, for example, respectiveportions where the first to third heat generation components P1 to P3are disposed. The heat collection/diffusion device may include a firstheat collection/diffusion member 2960 disposed adjacent to the firstheat generation component P1, a second heat collection/diffusion member2961 disposed adjacent to the second heat generation component P2, and athird heat collection/diffusion 2962 disposed adjacent to the third heatgeneration component P3. The first, second, and third heatcollection/diffusion members 2960 to 2962 may be individuallymanufactured and may be disposed to be spaced apart from each otheralong the heat pipe 2950. For the convenience of explanation, it isassumed that a PAM or an IF PMIC is a first heat generation componentP1, an AP is a second heat generation component P2, and a memory is athird heat generation component P3.

In the communication mode of the electronic device, since the first heatgeneration component P1 is the hot zone region having the highesttemperature, the heat generated from the first heat generation componentP1 can be collected by the first heat collection/diffusion member 2960,and the collected heat can be transferred to the heat pipe 2950 having arelatively low temperature. Subsequently, the heat, transferred to aperipheral region having a relatively low temperature can be diffused bythe second and third heat collection/diffusion members 2961 and 2962.

In the camera operation mode of the electronic device (e.g., a videophotographing mode), since the second heat generation component P2 isthe hot zone region having the highest temperature, the heat, generatedfrom the second heat generation component P2, can be collected by thesecond heat collection/diffusion member 2961, and the collected heat canbe diffused by each of the first and third collection/diffusion members2960 and 2962 via the heat pipe 2950 having a relatively lowtemperature.

Depending on the operation mode of the electronic device, i.e.,depending on the temperature difference between the first to third heatgeneration components P1 to P3, each of the first to third heatcollection/diffusion members 2960 to 2962 may serve to collect heat orto diffuse heat.

The term “module,” as used herein may represent, for example, a unitincluding a combination of one or two or more of hardware, software, orfirmware. The “module” may be, for example, used interchangeably withthe terms “unit”, “logic”, “logical block”, “component”, or “circuit”etc. The “module” may be the minimum unit of an integrally constructedcomponent or a part thereof. The “module” may be also the minimum unitperforming one or more functions or a part thereof. The “module” may beimplemented mechanically or electronically. For example, the “module”may include at least one of an application-specific integrated circuit(ASIC) chip, Field-Programmable Gate Arrays (FPGAs) and aprogrammable-logic device performing some operations known to the art orto be developed in the future.

At least a part of an apparatus (e.g., modules or functions thereof) ormethod (e.g., operations) according to the present invention may be, forexample, implemented as instructions stored in a computer-readablestorage medium in a form of a programming module. In case that theinstruction is executed by a processor (e.g., processor 120), and theprocessor may perform functions corresponding to the instructions. Thecomputer-readable storage media may be the memory 130, for instance.

The computer-readable recording medium may include a hard disk, a floppydisk, and a magnetic medium (e.g., a magnetic tape), an optical medium(e.g., a Compact Disc-Read Only Memory (CD-ROM) and a Digital VersatileDisc (DVD)), a Magneto-Optical Medium (e.g., a floptical disk), and ahardware device (e.g., a Read Only Memory (ROM), a Random Access Memory(RAM), a flash memory, etc.). Also, the program instruction may includenot only a mechanical language code such as a code made by a compilerbut also a high-level language code executable by a computer using aninterpreter, etc. The aforementioned hardware device may be constructedto operate as one or more software modules in order to performoperations of the present invention, and vice versa.

The module or programming module according to the present invention mayinclude at least one or more of the aforementioned constituent elements,or omit some of the aforementioned constituent elements, or furtherinclude additional other constituent elements. Operations carried out bythe module, the programming module or the other constituent elementsaccording to the present invention may be executed in a sequential,parallel, repeated or heuristic method. Also, some operations may beexecuted in different order or may be omitted, or other operations maybe added.

Meanwhile, the exemplary embodiments disclosed in the specification anddrawings are merely presented to easily describe the technical contentsof the present disclosure and help with the understanding of the presentdisclosure and are not intended to limit the scope of the presentdisclosure. Therefore, all changes or modifications derived from thetechnical idea of the present disclosure as well as the embodimentsdescribed herein should be interpreted to belong to the scope of thepresent disclosure.

1. An electronic device comprising: a housing including a first facethat faces a first direction, and a second face that faces a seconddirection, which is opposite the first direction; a printed circuitboard inserted between the first face and the second face; an electroniccomponent disposed on the printed circuit board; a shielding structureincluding a conductive structure at least partially enclosing theelectronic device, the shielding structure being mounted on the printedcircuit board; and a heat pipe including a first end and a second end,wherein the first end is thermally coupled to a portion of the shieldingstructure, and the first end is disposed closer to the shieldingstructure than the second end.
 2. The electronic device of claim 1,further comprising: a first thermal interfacing material disposedbetween the first end of the first heat pipe and the portion of theshielding structure, wherein the first thermal interfacing materialincludes at least one copper sheet.
 3. The electronic device of claim 2,further comprising: a second thermal interfacing material disposedbetween the electronic component and the portion of the shieldingstructure, wherein the second thermal interfacing material includes apaste-type material or silicone polymer.
 4. The electronic device ofclaim 1, further comprising: a display exposed through at least aportion of the first face; and a mid plate interposed between the secondface and the printed circuit board, wherein at least a portion of theheat pipe extends between the printed circuit board and the mid plate.5. The electronic device of claim 4, wherein the mid plate includes asurface directed toward the printed circuit board, the surface includingan elongated recess configured to accommodate at least a portion of theheat pipe, and the electronic device further comprises an adhesive layerinterposed between the at least a portion of the heat pipe and at leasta portion of the elongated recess.
 6. An electronic device comprising: asupport structure; a printed circuit board including a first face thatfaces the support structure and a second face opposite the first face;at least one heat generation source disposed on the first face of theprinted circuit board; a shielding structure including a conductivestructure at least partially enclosing the heat generation source, andmounted on the printed circuit board; and a heat pipe disposed on thesupport structure and having a first end and a second end opposite thefirst end, wherein the first end is thermally coupled to the heatgeneration source, so that heat is transferred from the heat generationsource.
 7. The electronic device of claim 6, wherein the shieldingstructure includes: a shield frame enclosing a side face of the heatgeneration source; and a shield cover configured to enclose a top faceof the heat generation source, and disposed on the shield frame so as toclose a space where the heat generation source exists.
 8. The electronicdevice of claim 6, wherein, between the heat generation source and theshielding structure, a first thermal interfacing material is disposed,and between the shielding structure and the heat pipe, a second thermalinterfacing material is disposed.
 9. The electronic device of claim 6,wherein, the first thermal interfacing material includes a liquidthermal interfacing material that is in contact with the heat generationsource, and a solid thermal interfacing material that is in contact withthe shielding structure and is stacked on the liquid thermal interfacingmaterial, and the second thermal interfacing material is bonded to thesupport structure.
 10. An electronic device comprising: a supportstructure; a printed circuit board including a first face that faces thesupport structure and a second face opposite the first face; at leastone heat generation source disposed on the first face of the printedcircuit board; a shielding structure including a conductive structure atleast partially enclosing the heat generation source, and mounted on theprinted circuit board; a heat pipe disposed on the support structure andhaving a first portion and a second portion opposite the first portion,wherein the first portion is thermally coupled to the heat generationsource, and the heat pipe transfers heat of the first portion, which istransferred from the heat generation source, to the second portion; anda heat collection device disposed on the support structure and thermallycoupled to the heat generation source so as to collect heat, generatedfrom the heat generation source, at the first portion of the heat pipe.11. The electronic device of claim 10, wherein the heat collectingdevice has a recess formed therein such that at least a portion of thefirst end of the heat pipe is inserted into the recess, and theelectronic device includes an adhesive layer or solder between one sideof the recess and at least a portion of the first end.
 12. Theelectronic device of claim 10, wherein the heat collection device isconfigured such that a face facing the heat generation source is formedto have a size that is equal to or smaller than a size of a top face ofthe heat generation source.
 13. The electronic device of claim 10,wherein at least a portion of the support structure includes an openingextending along the heat pipe, and the opening is filled with aninsulating material.
 14. An electronic device comprising: a housingincluding a first face that faces a first direction, and a second facethat faces a second direction, which is opposite the first direction; aprinted circuit board inserted between the first face and the secondface; a plurality of heat generation components disposed on the printedcircuit board; a shielding structure including a conductive structure atleast partially enclosing the electronic device, the shielding structurebeing mounted on the printed circuit board; a heat pipe including afirst portion and a second portion, wherein the first portion isthermally coupled to a portion of the shielding structure, and the firstportion is disposed closer to the shielding structure than the secondportion; and at least one heat collection/diffusion member disposedbetween each of the heat generation components and the heat pipe to bethermally coupled thereto so as to collect heat of the heat generationcomponents, or to diffuse heat, transferred via the heat pipe, to aperipheral region.
 15. The electronic device of claim 14, wherein theheat collection/diffusion member includes: a first heatcollection/diffusion member thermally coupled to a first heat generationcomponent and coupled to the first portion of the heat pipe; and asecond heat collection/diffusion member thermally coupled to a secondheat generation component and coupled to the second portion of the heatpipe, the second heat collection/diffusion member being spaced apartfrom the first heat collection/diffusion member.
 16. The electronicdevice of claim 15, wherein, in a first mode of the electronic device, aheat generation temperature of the first heat generation component ishigher than a heat generation temperature of the second heat generationcomponent, so that the first heat collection/diffusion member collectsand transfers heat of the first heat generation component to the heatpipe, the transferred heat is diffused to the peripheral region by thesecond heat collection/diffusion member, and in a second mode of theelectronic device, a heat generation temperature of the second heatgeneration component is higher than a heat generation temperature of thefirst heat generation component, so that the second heatcollection/diffusion member collects and transfers heat of the secondheat generation component to the heat pipe, the transferred heat isdiffused to the peripheral region by the first heat collection/diffusionmember.